Araştırma Çıktıları | WoS | Scopus | TR-Dizin | PubMed
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Publication Metadata only Changes in mechanical properties of copper-silver matrix welded by the iron blade by increasing initial pressure: A molecular dynamics approach(ELSEVIER, 2024) Ayadi, Badreddine; Jasim, Dheyaa J.; Sajadi, S. Mohammad; Nasajpour-Esfahani, Navid; Salahshour, Soheil; Esmaeili, Shadi; Sabetvand, Rozbeh; Elhag, Ahmed Faisal Ahmed; University Ha'il; Universite de Sfax; Ecole Nationale dIngenieurs de Sfax (ENIS); Al-Amarah University College; Cihan University-Erbil; University System of Georgia; Georgia Institute of Technology; Okan University; Lebanese American University; Bahcesehir University; Semnan University; Amirkabir University of Technology; Qassim UniversityAtomic investigation of many common phenomena can be included as interesting achievements. Using these achievements makes it possible to design promising structures for various actual applications. The current research describes the mechanical performance of Ag and Cu samples after welding at various initial pressures. For this purpose, the Molecular Dynamics (MD) approach is used via the LAMMPS package. Technically, MD simulations are done in 2 main steps. Firstly, the atomic stability of welded Ag-Cu samples is described at various initial conditions (initial pressure). Then, tension test settings are implemented in equilibrated systems. The MD outputs indicate that the physical stability of the welded samples was altered by changing the initial pressure between 1 and 10 bar. Simulation results predict that the mechanical resistance of atomic samples decreases by enlarging the initial pressure. Numerically, the ultimate strength of the Ag-Cu matrixes decreases from 1.424 MPa to 1.241 MPa by increasing the initial pressure from 1 bar to 10 bar, respectively. This mechanical performance arises from atomic disorder created inside samples. So, it is expected that initial condition changes affect the atomic evolution of welded metallic samples, and this phenomenon should be considered in the design of mechanical structures in industrial cases.Publication Metadata only A new model for viscosity prediction for silica-alumina-MWCNT/Water hybrid nanofluid using nonlinear curve fitting(ELSEVIER - DIVISION REED ELSEVIER INDIA PVT LTD, 2024) Qu, Meihong; Jasim, Dheyaa J.; Alizadeh, As'ad; Eftekhari, S. Ali; Nasajpour-Esfahani, Navid; Zekri, Hussein; Salahshour, Soheil; Toghraie, Davood; Al-Amarah University College; Cihan University-Erbil; Islamic Azad University; University System of Georgia; Georgia Institute of Technology; University of Zakho; Bahcesehir University; Lebanese American University; Okan UniversityOne of the most crucial concerns is improving industrial equipment's ability to transmit heat at a faster rate, hence minimizing energy loss. Viscosity is one of the key elements determining heat transmission in fluids. Therefore, it is crucial to research the viscosity of nanofluids (NF). In this study, the effect of temperature (T) and the volume fraction of nanoparticles (phi) on the viscosity of the silica-alumina-MWCNT/Water hybrid nanofluid (HNF) is examined. In this study, a nonlinear curve fitting is accurately fitted using MATLAB software and is used to identify the main effect, extracting the residuals and viscosity deviation of these two input variables, i.e., temperature (T = 20 to 60 C-degrees) and volume fraction of nanoparticles (phi = 0.1 to 0.5 %). The findings demonstrate that the viscosity of silica-alumina-MWCNT/ Water hybrid nanofluid increases as the phi increases. In terms of numbers, the mu nf rises from 1.55 to 3.26 cP when the phi grows from 0.1 to 0.5 % (at T = 40 C-degrees). On the other hand, the mu nf decreases as the temperature was increases. The mu(nf) of silica-alumina-MWCNT/ Water hybrid nanofluid reduces from 3.3 to 1.73 cP when the temperature rises from 20 to 60 C-degrees (at phi = 0.3 %). The findings demonstrate that the mu nf exhibits greater variance for lower temperatures and higher phi.Publication Metadata only Experimental study of phase change material (PCM) based spiral heat sink for the cooling process of electronic equipment(ELSEVIER, 2024) Wang, Yu; Jasim, Dheyaa J.; Sajadi, S. Mohammad; Smaisim, Ghassan Fadhil; Hadrawi, Salema K.; Nasajpour-Esfahani, Navid; Alizade, Morteza; Zarringhalam, Majid; Salahshour, Soheil; Toghraie, D.; Al-Amarah University College; Cihan University-Erbil; University of Kufa; University of Kufa; Islamic University College; Imam Reza International University; Islamic Azad University; Islamic Azad University; Okan University; Bahcesehir University; Lebanese American University; University System of Georgia; Georgia Institute of Technology; Islamic Azad UniversityToday, every device that a person uses depends on electronic equipment, frequent and long-term use of it causes to heat up and as a result, slow down the speed and performance of that device. In more important and sensitive equipment such as medical equipment, slow speed and reduced performance cause irreparable damage. Therefore, to cool these devices, their internal electronic equipment must be cooled. In studies by others, the simultaneous use of several phase change materials and airflow in the form of layer-by-layer contact was usually less studied. In this study, using CNC machining, a heatsink consisting of 2 spirals was produced. In the first spiral, PCM Paraffin Wax with different volume percentages and in the second spiral, the presence or absence of forced airflow in heat transfer rate 2.9 W to 3.7 W was tested with a step of 0.4 W and the results were that by adding %50 PCM and adding 100 % PCM to the system, its performance increases by 7.19 % and 44.91 %, respectively, which shows using the maximum volume capacity of PCM increases efficiency. Also, by adding forced airflow to the system, its performance has increased by 7.71 %. It can be said that if the forced airflow in the system is used layer by layer, it prevents the heat from concentrating in certain parts of the heatsink and the circuit, which results in the same heating of the whole system and the heat is evenly distributed throughout the heatsink.Publication Metadata only A numerical study of initial pressure effects on the water/silver nanofluid interaction with SARS-CoV-2 structure, a molecular dynamics method(ELSEVIER, 2024) Li, Xiaobo; Jasim, Dheyaa J.; Sajadi, S. Mohammad; Fan, Guang; Al-Rubaye, Ameer H.; Nasajpour-Esfahani, Navid; Salahshour, Soheil; Sabetvand, Rozbeh; Xianyang Normal University; Al-Amarah University College; Cihan University-Erbil; Al-Kitab University; University System of Georgia; Georgia Institute of Technology; Okan University; Bahcesehir University; Lebanese American University; Islamic Azad UniversityThe stability of the SARS virus can be affected by various environmental factors, including temperature, humidity, and pressure. In the present research, the effect of initial pressure on the stability of the SARS virus in the presence of water/Ag nanofluid (NF) is investigated using molecular dynamics (MD) simulation. The results revealed that initial pressure effectively changes the atomic evolution of the virus-NF system. Numerically, the diffusion coefficient of modeled samples changes from 32.33 nm2/ns to 9.489 nm2/ns by initial pressure varies from 1 bar to 10 bar. This structural evolution caused interatomic distance and force between virus particle changes. Finally, interaction energy is changed by initial pressure variation, and this parameter varies between -0.44695 kcal/mol to -24.65127 kcal/mol in defined initial conditions. From MD outputs, it was concluded physical stability of the SARS virus in the presence of water/silver NF can be manipulated by initial pressure. So, the SARS virus destruction process with water/silver NF affected from the initial pressure ratio, appropriately. Future directions for this research project may involve exploring the influence of additional environmental factors and utilizing the gained knowledge to develop antiviral materials. This study establishes a foundation for further investigations into the interaction between environmental factors, NFs, and viral infections, with the potential to contribute to the development of effective strategies for combating viral infections and designing innovative antiviral solutions.Publication Metadata only Offering a channel for cooling three lithium-ion battery packs with water/ Cu nanofluid: An exergoeconomic analysis(ELSEVIER, 2024) Zhao, Long; Jasim, Dheyaa J.; Alizadeh, As 'ad; Shirani, Nima; Nasajpour-Esfahani, Navid; Salahshour, Soheil; Shamsborhan, Mahmoud; Yangzhou University; Al-Amarah University College; Cihan University-Erbil; Islamic Azad University; University System of Georgia; Georgia Institute of Technology; Okan University; Bahcesehir University; Lebanese American University; University of ZakhoThis study focused on addressing the heat generation issue in Lithium -Ion battery packs (LIBPs). By simulating three LIBPs arranged in series within a duct, the momentum and energy conservation equations were solved using Computational Fluid Dynamics (CFD) to investigate cooling performance on the LIBPs ' temperature. To enhance cooling, copper oxide nanoparticles were added to pure water to improve the thermal conductivity of the working fluid. Various cases were simulated to examine the effects of Reynolds number at inlet and volume fraction of copper oxide nanoparticles on flow parameters (streamlines, vortices, pressure drop) and heat transfer parameters (temperature distribution, maximum and average temperature of each LIBP) within the duct. Also, this study analyzed exergoeconomics by considering exergies and initial investment. The results demonstrate that increasing the volume fraction from 0 to 4 % at Re = 60 reduced the maximum temperature of LIBP 1, 2, and 3 by 2.19 degrees C, 2.26 degrees C, and 2.64 degrees C, respectively, while it had no remarkable impact on the maximum temperature of LIBPs for bigger Reynolds numbers.Publication Metadata only Bonding properties of Al/Sn/Al laminates fabricated via electrically press bonding process(ELSEVIER, 2024) Daneshmand, Saeed; Vini, Mohammad Heydari; Sajadi, S. Mohammad; Jasim, Dheyaa J.; Salahshour, Soheil; Hekmatifar, M.; Nasajpour-Esfahani, Navid; Islamic Azad University; Islamic Azad University; Cihan University-Erbil; Al-Amarah University College; Okan University; Bahcesehir University; Lebanese American University; Islamic Azad University; University System of Georgia; Georgia Institute of TechnologyIn the late 1980s, electrically assisted press bonding gained attention in the semiconductor industry due to its ability to improve bond quality and reliability. This bonding method has several advantages, including improved bond strength, reduced bonding time, and the ability to bond materials that are traditionally challenging to bond. This connection method is commonly used in applications where high band strength, reliability, and electrical conductivity are critical, such as microelectronics manufacturing, semiconductor devices, and advanced packaging technologies. In this study, AA1100 bars were connected using an electrically assisted press connection process at current levels of 100A, 200A and 300A. Poor bond strength is an important drawback in bonding processes. Therefore, to solve this problem, Sn particles were used as a finishing process and filler metal to increase the bond strength of aluminum sheets during electric press joining. AA1100 bars were produced with different weight percentages (wt%) of Sn particles as interlayer filler at different levels of electric current. The results reveal that increasing the level of electric current and the weight percentage of Sn leads to stronger bond strength. In this study, a scanning electron microscope (SEM) is used to check the quality of the bond. It is worth mentioning that the analysis of the exfoliation surface by SEM is performed on the samples after the peeling test to check the quality of the bond. In addition, the findings reveal that the bond strength improves with Sn content and higher current levels due to the Joule heating effect in the electrical press bonding process.